US Patent Issued to SAMSUNG ELECTRONICS on May 19 for "Sensor module and substrate processing apparatus using the same" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,460, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Sensor module and substrate processing apparatus using the same" was invented by Daejung Kim (Suwon-si, South Korea), Minyoung Kang (Suwon-si, South Korea), Sungsoo Kim (Suwon-si, South Korea), Sohee Kim (Suwon-si, South Korea), Yongsoo Yoo (Suwon-si, South Korea) and Jihyeon Ha (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor module includes a body including a first body part and a second body part detachably coupled to the first body part, a first sensor unit on a lower surface of the body, and configured to detect a contact a...