ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,668, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor package" was invented by Raehyung Do (Asan-si, South Korea), Seunghyun Go (Asan-si, South Korea), Jungsik Lee (Seoul, South Korea), Jongho Lee (Hwaseong-si, South Korea), Younghun Cheong (Seoul, South Korea) and Cheolsoo Han (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package comprising a substrate including substrate pads on a top surface thereof, a first upper semiconductor chip on the substrate and including conductive chip pads, and bonding wires coupled to the substrate pads and the first up...