US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Electronic device housing and electronic device including the same" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,625,569, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Electronic device housing and electronic device including the same" was invented by Hyunjung Jung (Suwon-si, South Korea), Hangyu Hwang (Suwon-si, South Korea), Hyeonseok Yoon (Suwon-si, South Korea) and Hyoin Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device housing includes an instrument, a first primer layer provided to cover the instrument, a film layer provided on the first primer layer, a second primer layer provided on the film layer, and a coating layer provided on the second primer layer. The film layer i...