US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Chip-on-film package and a display device including the same" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,626,623, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Chip-on-film package and a display device including the same" was invented by Kyoungsuk Yang (Suwon-si, South Korea) and Jinchul Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip-on-film package including: a base film; chip pads including a first signal pad, a second signal pad, first dummy pads, and second dummy pads, wherein the chip pads are connected to a semiconductor chip attached to the base film; and wiring patterns including a first signal pattern connected to the first signal pad, a second signal pattern connected to...