ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,640, issued on March 31, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor wafer processing device" was invented by Min Joon Kim (Gwangmyeong-si, South Korea), Jin Seok Lee (Seoul, South Korea), Bong Ju Lee (Hwaseong-si, South Korea), Tae Jong Yu (Hwaseong-si, South Korea), Tae Sun Shin (Hwaseong-si, South Korea) and Sung Il Cho (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a semiconductor device capable of improving the performance and reliability of a device. The semiconductor wafer processing device comprising a chamber, and, a showerhead configured to supply a gas into...