US Patent Issued to SAMSUNG ELECTRONICS on March 31 for "Semiconductor package including stacked semiconductor devices and method of manufacturing the semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,708, issued on March 31, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including stacked semiconductor devices and method of manufacturing the semiconductor package" was invented by Hyunsu Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first package substrate. A first semiconductor device is mounted on an upper surface of the first package substrate. A first molding is disposed on the first package substrate and covers the first semiconductor device. A second package substrate is disposed on the first molding. At least one second semiconduct...