US Patent Issued to SAMSUNG ELECTRONICS on March 31 for "Semiconductor package" (South Korean, Japanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,685, issued on March 31, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Jaehoon Choi (Suwon-si, South Korea), Sayoon Kang (Suwon-si, South Korea), Taewook Kim (Suwon-si, South Korea), Hwasub Oh (Suwon-si, Japan) and Jooyoung Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a connection structure having first and second surfaces opposing each other and including a first redistribution layer; a semiconductor chip disposed on the first surface of the connection structure and including connection pads connected to the first redistri...