US Patent Issued to SAMSUNG ELECTRONICS on March 31 for "Etching composition, method of etching metal-containing film by using the same, and method of preparing semiconductor device by using the same" (South Korean Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,247, issued on March 31, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Etching composition, method of etching metal-containing film by using the same, and method of preparing semiconductor device by using the same" was invented by Kyuyoung Hwang (Suwon-si, South Korea), Byungjoon Kang (Suwon-si, South Korea), Daihyun Kim (Suwon-si, South Korea), Sungmin Kim (Suwon-si, South Korea), Hwang Suk Kim (Suwon-si, South Korea), Mihyun Park (Suwon-si, South Korea), Jungmin Oh (Suwon-si, South Korea), Hyosan Lee (Suwon-si, South Korea) and Byoungki Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided...