US Patent Issued to SAMSUNG ELECTRONICS on March 3 for "Three-dimensional semiconductor integrated circuit device including inter-die interface" (South Korean Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,816, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Three-dimensional semiconductor integrated circuit device including inter-die interface" was invented by Jae Seung Choi (Suwon-si, South Korea), Byung-Su Kim (Suwon-si, South Korea), Bong Il Park (Suwon-si, South Korea), Chang Seok Kwak (Suwon-si, South Korea), Sun Hee Park (Suwon-si, South Korea) and Sang Joon Cheon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional semiconductor integrated circuit device including an inter-die interface is provided. The device includes a top die including a plurality of micro cells ...