US Patent Issued to SAMSUNG ELECTRONICS on March 3 for "Semiconductor package and method of manufacturing the same" (South Korean Inventor)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,836, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the same" was invented by Seungmin Kim (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate including a substrate body having a lower surface and a upper surface, a lower wiring layer on the lower surface and including a land region, an upper wiring layer on the upper surface and electrically connected to the lower wiring layer, and a solder resist layer on the lower surface and including an opening exposing the land region. The semiconduc...