US Patent Issued to SAMSUNG ELECTRONICS on March 3 for "Semiconductor chip, semiconductor package including the same, and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,837, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor chip, semiconductor package including the same, and method of fabricating the same" was invented by Young Kun Jee (Suwon-si, South Korea), Jihwan Hwang (Suwon-si, South Korea) and Chungsun Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip including a semiconductor substrate having first and second surfaces, a transistor on the first surface, a first interlayer dielectric layer on the transistor, a second interlayer dielectric layer on the first interlayer dielectric layer, a wiring line in the seco...