US Patent Issued to SAMSUNG ELECTRONICS on March 3 for "Multi-chip for performing chiplet security authentication and method of manufacturing the same" (South Korean Inventor)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,837, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Multi-chip for performing chiplet security authentication and method of manufacturing the same" was invented by Hyungseuk Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a multi-chip includes generating a first authentication certificate in a first die using a private key of the first die, verifying the first authentication certificate in a second die using a public key of the first die, generating a second authentication certificate in the second die using a private key of the second die, and verifying t...