US Patent Issued to SAMSUNG ELECTRONICS on March 3 for "Micro semiconductor chip transfer substrate and method of manufacturing display apparatus" (South Korean Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,861, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Micro semiconductor chip transfer substrate and method of manufacturing display apparatus" was invented by Kyungwook Hwang (Seoul, South Korea), Junsik Hwang (Hwaseong-si, South Korea), Dongkyun Kim (Suwon-si, South Korea), Dongho Kim (Seoul, South Korea), Hyunjoon Kim (Seoul, South Korea), Joonyong Park (Suwon-si, South Korea) and Seogwoo Hong (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a micro semiconductor chip transfer substrate including a base substrate, guide rails provided on the base substrate extending in a ...