US Patent Issued to SAMSUNG ELECTRONICS on March 24 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,558, issued on March 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by YeongBeom Ko (Suwon-si, South Korea) and Junyun Kweon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes at least one semiconductor module on a substrate. The semiconductor module includes a first semiconductor chip having a first surface and a second surface opposite to the first surface, a second semiconductor chip on the first surface, a plurality of conductive pillars on the first surface, and a redistribution substrate on the second semiconductor chip and the ...