US Patent Issued to SAMSUNG ELECTRONICS on March 24 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,567, issued on March 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by Aenee Jang (Suwon-si, South Korea) and Wonil Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip, a plurality of second semiconductor chips stacked on the first semiconductor chip, and having widths narrower than a width of the first semiconductor chip, and a molded layer on an upper surface of the first semiconductor chip. The first semiconductor chip includes first front-surface pads, a first back-surface insulating layer divided int...