ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,562, issued on March 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Kiwon Baek (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package including a package substrate including a substrate pad, a first chip stacked structure including a first base chip mounted on an upper surface of the package substrate, and one or more first stacked chips sequentially offset-stacked along a first direction on the first base chip, a second chip stacked structure including a second base chip offset-stacked along the first direction on an upper surface ...