ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,136, issued on March 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board comprising ground wire" was invented by Eunseok Hong (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes: a first layer including a first ground including a first opening, wherein a first ground wire is within the first opening; a second layer disposed in a direction from the first layer and including a second ground including a second opening, wherein the second opening at least partially overlaps with the first opening and wherein a second ground wire is within the second opening;...