US Patent Issued to SAMSUNG ELECTRONICS on March 24 for "Packing displacement component sample in the displacement video frame for dynamic mesh coding" (California, Texas Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,587,683, issued on March 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Packing displacement component sample in the displacement video frame for dynamic mesh coding" was invented by Rajan Laxman Joshi (San Diego) and Madhukar Budagavi (Plano, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus receives a compressed bitstream including an encoded displacements bitstream and packing method information indicating whether the displacement component samples are packed in ascending order or in descending order. The apparatus video-decodes the encoded displacements bitstream to generate a displacement video frame, wh...