US Patent Issued to SAMSUNG ELECTRONICS on March 17 for "Substrate processing apparatus and a method of processing a substrate using the same" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,895, issued on March 17, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Substrate processing apparatus and a method of processing a substrate using the same" was invented by Junghyun Song (Suwon-si, South Korea), Ansook Sul (Suwon-si, South Korea), Jeonghun Kang (Suwon-si, South Korea), Donok Choi (Suwon-si, South Korea) and Sung Yong Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes an outer bath, an inner bath in the outer bath, a chemical solution supply pipe in fluid communication with a portion of the outer bath, and an outer gas supply pipe in fluid com...