US Patent Issued to SAMSUNG ELECTRONICS on March 17 for "Semiconductor package including under bump metallization pad" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,978, issued on March 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including under bump metallization pad" was invented by Hyeonjeong Hwang (Suwon-si, South Korea), Kyounglim Suk (Suwon-si, South Korea) and Seokhyun Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor chip, a lower redistribution layer disposed under the semiconductor chip, the lower redistribution layer including a plurality of lower insulating layers, a plurality of lower redistribution patterns, and a plurality of lower conductive vias, a lower passivation lay...