US Patent Issued to SAMSUNG ELECTRONICS on March 17 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,948, issued on March 17, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by Kyungdon Mun (Suwon-si, South Korea), Eungkyu Kim (Suwon-si, South Korea) and Hyeonseok Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first redistribution structure, a first die above the first redistribution structure, a second die above the first die, a heat dissipation unit on side surfaces of the first die or the second die, and a second redistribution structure above the second die. The semiconductor package includes a first post protruding from an ...