US Patent Issued to SAMSUNG ELECTRONICS on March 17 for "Semiconductor devices incorporating semiconductor layer configurations and methods of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,634, issued on March 17, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor devices incorporating semiconductor layer configurations and methods of manufacturing the same" was invented by Jin-Bum Kim (Seoul, South Korea), Myung-Gil Kang (Suwon-si, South Korea), Kang-Hun Moon (Incheon, South Korea), Cho-Eun Lee (Pocheon-si, South Korea), Su-Jin Jung (Hwaseong-si, South Korea), Min-Hee Choi (Suwon-si, South Korea), Yang Xu (Hwaseong-si, South Korea), Dong-Suk Shin (Yongin-si, South Korea), Kwan-Heum Lee (Suwon-si, South Korea) and Hoi-Sung Chung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A ...