US Patent Issued to SAMSUNG ELECTRONICS on March 17 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,989, issued on March 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device and method of fabricating the same" was invented by Sangho Cha (Suwon-si, South Korea) and Wonjung Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are semiconductor devices and their fabrication methods. The semiconductor device comprises a pad on a semiconductor chip, a protective layer on the semiconductor chip and having an opening that exposes a portion of a top surface of the pad, and a bump structure electrically connected to the pad. The bump structure includes a metal layer on the pad and ...