US Patent Issued to SAMSUNG ELECTRONICS on March 17 for "Plasma processing apparatus, substrate bonding system including the same, and substrate bonding method using the same" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,580,158, issued on March 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Plasma processing apparatus, substrate bonding system including the same, and substrate bonding method using the same" was invented by Inhwa Baek (Hwaseong-si, South Korea), Donggap Shin (Seoul, South Korea), Yongin Lee (Seoul, South Korea), Se-Hoon Jang (Hwaseong-si, South Korea), Youngho Kim (Gwangju-si, South Korea), Ho Kim (Hwaseong-si, South Korea), Seungdae Seok (Seongnam-si, South Korea) and Siwoong Woo (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Plasma processing apparatuses, substrate bonding systems, and substrate b...