US Patent Issued to SAMSUNG ELECTRONICS on March 17 for "Memory device and method of fabricating memory device including a test circuit" (South Korean Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,580,034, issued on March 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Memory device and method of fabricating memory device including a test circuit" was invented by Jungpil Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory device which including a memory chip that includes a memory cell array connected to word lines and bit lines, a test circuit connected to the word lines and the bit lines, and a first bonding metal pattern connected to the word lines and the bit lines, and a peripheral circuit chip that includes a peripheral circuit and a second bonding metal pattern. The test circuit pe...