ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,769, issued on March 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Chip wet transfer apparatus" was invented by Hyunjoon Kim (Suwon-si, South Korea), Kyungwook Hwang (Suwon-si, South Korea), Dongkyun Kim (Suwon-si, South Korea), Dongho Kim (Suwon-si, South Korea), Joonyong Park (Suwon-si, South Korea), Minchul Yu (Suwon-si, South Korea), Seogwoo Hong (Suwon-si, South Korea) and Junsik Hwang (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip wet transfer apparatus includes a first chip supply module configured to supply a large amount of micro-semiconductor chips to a transfer substrate, a first...