US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,035, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Inhyung Song (Cheonan-si, South Korea), Jongyoun Kim (Seoul, South Korea) and Shanghoon Seo (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: an encapsulation layer sealing at least one semiconductor chip; a redistribution level layer arranged on the encapsulation layer; a laser mark metal layer arranged on the redistribution level layer; and a laser mark arranged inside the laser mark metal layer. The laser mark includes letters, numbers, figures, symbols, and rec...