US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Thermal imaging sensor, and camera module and electronic device including thermal imaging sensor" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,671,914, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Thermal imaging sensor, and camera module and electronic device including thermal imaging sensor" was invented by Ki Ho Kong (Suwon-si, South Korea), Jin Myoung Kim (Suwon-si, South Korea), Se Yoon Kim (Suwon-si, South Korea) and Du Hyun Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal imaging sensor may include: a pixel array in which pixels with microbolometers are arranged in an MxN matrix, where M and N are integers greater than or equal to 2; a row controller configured to output a row control signal through one or m...