ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,386, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Chip wet-transferring device" was invented by Youngtek Oh (Suwon-si, South Korea), Kyungwook Hwang (Suwon-si, South Korea), Dongkyun Kim (Suwon-si, South Korea), Dongho Kim (Suwon-si, South Korea), Joonyong Park (Suwon-si, South Korea), Sanghoon Song (Suwon-si, South Korea), Minchul Yu (Suwon-si, South Korea) and Junsik Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip wet-transferring device includes a chamber, a support member provided in the chamber and configured to support a transfer substrate, the transfer substrate i...