US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Apparatus for manufacturing semiconductor device and method for manufacturing semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,909, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Apparatus for manufacturing semiconductor device and method for manufacturing semiconductor device using the same" was invented by Ji Hun Kim (Suwon-si, South Korea), Youn Gon Oh (Suwon-si, South Korea), Woo-Ram Moon (Suwon-si, South Korea), Sang Hyuk Park (Suwon-si, South Korea), Jong Hun Lee (Suwon-si, South Korea) and Kyu-Sik Jeong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for manufacturing a semiconductor device includes a substrate transfer unit configured to transfer a substrate, a rail unit including a drivin...