US Patent Issued to SAMSUNG ELECTRONICS on June 2 for "Integrated circuit including backside wiring and method of designing the same" (South Korean Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,646,535, issued on June 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Integrated circuit including backside wiring and method of designing the same" was invented by Youngrok Park (Suwon-si, South Korea), Hoyoung Tang (Suwon-si, South Korea) and Taehyung Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit includes a substrate; a bit cell array including bit cells on the substrate; a frontside wiring layer above the substrate in a vertical direction with respect to a front side of the substrate, the frontside wiring layer including local word lines connected to the bit cells; a row dec...