ALEXANDRIA, Va., June 2 -- United States Patent no. 12,643,168, issued on June 2, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Apparatus for soldering electronic devices" was invented by Kyungdeuk Min (Suwon-si, South Korea), Sinyeop Lee (Suwon-si, South Korea), Taegyu Kang (Suwon-si, South Korea) and Jaeseon Hwang (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus may include a base plate configured to support a package substrate, semiconductor chips on the package substrate in rows and columns; a lamp heater configured to irradiate light to the semiconductor chips to mount the semiconductor chips on the package substrate; and a pressurization mask i...