US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Semiconductor package including heat dissipation layers" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,622, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including heat dissipation layers" was invented by Seunghyun Cho (Suwon-si, South Korea) and Jae-Min Jung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a flexible insulating substrate including a first surface and a second surface opposite to the first surface, a first wiring on the first surface of the flexible insulating substrate, a second wiring on the second surface of the flexible insulating substrate, a plurality of vias coupling the first wiring to the second wiring, a p...