ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,621, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Yeongbeom Ko (Suwon-si, South Korea), Junyun Kweon (Suwon-si, South Korea) and Wonil Seo (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip, a lower redistribution structure electrically connected to the first semiconductor chip, an upper redistribution structure on the first semiconductor chip, a conductive post electrically connecting the upper redistribution structure to the lower redistribution structure, and a first wire connecting a l...