US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Semiconductor device including stack region and pad region having different thickness" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,193, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device including stack region and pad region having different thickness" was invented by Sang-Lok Kim (Seoul, South Korea), Sang Soo Park (Hwaseong-si, South Korea), Jung-June Park (Seoul, South Korea), Su Chang Jeon (Seoul, South Korea) and Sung-Min Joe (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are semiconductor devices and semiconductor packages. The semiconductor device comprises a semiconductor substrate that includes a stack region and a pad region, a peripheral circuit structure that includes a plurali...