US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Semiconductor device and method for fabricating thereof" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,258, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor device and method for fabricating thereof" was invented by Dong Suk Shin (Suwon-si, South Korea), Hyun-Kwan Yu (Suwon-si, South Korea), Seok Hoon Kim (Suwon-si, South Korea), Pan Kwi Park (Incheon, South Korea), Yong Seung Kim (Seongnam-si, South Korea) and Jung Taek Kim (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a lower pattern extending in a first direction and sheet patterns spaced apart therefrom in a second direction, a gate structure on the lower pattern and including a gate in...