US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,814, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Young-Ja Kim (Suwon-si, South Korea), Sunwon Kang (Suwon-si, South Korea) and Mi-Na Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first substrate. A second substrate is spaced apart from the first substrate. A semiconductor chip is between the first substrate and the second substrate. The semiconductor chip is electrically connected to the second substrate. A molding layer surrounds the semiconductor chip. A plate directly contacts a bottom surface of the...