US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,811, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by Won Il Lee (Suwon-si, South Korea), Hyungchul Shin (Suwon-si, South Korea), Gwangjae Jeon (Suwon-si, South Korea) and Enbin Jo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip including a first main region and a first edge region, and a second semiconductor chip on the first semiconductor chip and including a second main region and a second edge region. The first semiconductor chip includes a first main pad and a first dummy pad respectiv...