US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor device testing apparatus and methods of testing and fabricating semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,693,268, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device testing apparatus and methods of testing and fabricating semiconductor device using the same" was invented by Sung Yoon Ryu (Suwon-si, South Korea), Donghyun Lee (Suwon-si, South Korea), Sooseok Lee (Suwon-si, South Korea) and Younghoon Sohn (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a semiconductor device may include disposing a first aperture on a surface of a substrate; positioning a first ultrasonic wave receiving probe on the surface of the substrate in the first aperture; disposi...