US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,463, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Choongbin Yim (Suwon-si, South Korea), Hyonchol Kim (Suwon-si, South Korea), Sungbum Kim (Suwon-si, South Korea), Gitae Park (Suwon-si, South Korea), Jiyong Park (Suwon-si, South Korea), Jinwoo Park (Suwon-si, South Korea) and Jongbo Shim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a package substrate including a redistribution layer, a lower protective layer, and a plurality of support protrusions, wherein the redistribution layer has first and second pads d...