ALEXANDRIA, Va., July 16 -- United States Patent no. 12,364,040, issued on July 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Donghoon Gang (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip having a first surface and a second surface opposite to each other, a second semiconductor chip on the second surface of the first semiconductor chip and electrically connected to the first semiconductor chip, and a molding pattern bordering side surfaces of the first semiconductor chip and side surfaces of the second semiconductor chip. At least a portion of the first surface...