US Patent Issued to SAMSUNG ELECTRONICS on July 15 for "Electronic device including processor executing defect detection module, operating method of electronic device, and method for fabricating semiconductor integrated circuit" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,361,537, issued on July 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Electronic device including processor executing defect detection module, operating method of electronic device, and method for fabricating semiconductor integrated circuit" was invented by Min-Cheol Kang (Hwaseong-si, South Korea), Sooryong Lee (Seoul, South Korea) and Kyen-Hee Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a semiconductor integrated circuit fabricating method of a semiconductor fabricating device which includes a processor executing a defect detection module includes receiving, at the defect detection ...