US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Strip substrate and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,196, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Strip substrate and semiconductor package including the same" was invented by Jinmo Kwon (Suwon-si, South Korea), Jitaek Oh (Suwon-si, South Korea) and Hyoungjoon Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A strip substrate comprises a dielectric layer comprising a unit region and a saw line region, a saw line pattern on the saw line region, a conductive dummy pattern extending from the saw line pattern and toward the unit region, and power/ground patterns on the unit region. The power/ground pattern includes a first lateral ...