US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,786, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Hyunsoo Chung (Suwon-si, South Korea), Young Lyong Kim (Suwon-si, South Korea) and Inhyo Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package may include a substrate, a chip structure mounted on the substrate, and a first dummy structure attached to the chip structure. The chip structure may include a first semiconductor chip, a second dummy structure disposed at a side of the first semiconductor chip, and a mold layer enclosing the firs...