US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,200, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by Tae Yeong Kim (Suwon-si, South Korea), Jun Hong Min (Suwon-si, South Korea), Eun Suk Jung (Suwon-si, South Korea) and So Hye Cho (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first substrate including silicon, a first insulating layer in contact with the first substrate, the first insulating layer including silicon oxide, the first insulating layer having a first concentration of silicon, a second insulating layer in contact with the first insulating layer, th...