US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Plasma processing apparatus and method of manufacturing semiconductor device" (South Korean Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,683,133, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Plasma processing apparatus and method of manufacturing semiconductor device" was invented by Jeongil Mun (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method of manufacturing a semiconductor device. The method comprises loading a substrate having a first diameter onto a substrate support within a plasma chamber, performing a plasma process on the substrate, unloading the substrate from the plasma chamber, loading a dummy substrate having a second diameter smaller than the first diameter onto the substrate support, and...