US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Method for predicting defect in semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,074, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method for predicting defect in semiconductor device" was invented by Taeyoon An (Hwaseong-si, South Korea), Sangwoon Lee (Seoul, South Korea), Sungjin Kim (Hwaseong-si, South Korea), Seunghyun Kim (Seoul, South Korea), Wonki Roh (Yongin-si, South Korea), Chulwoo Park (Seoul, South Korea), Seongjae Byeon (Suwon-si, South Korea), Joohyun Jeon (Hwaseong-si, South Korea) and Hyoeun Jung (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for predicting a defect in a semiconductor device includes: calculating a first probability t...