US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Image sensor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,882, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Image sensor package and method of fabricating the same" was invented by Youngjae Choi (Suwon-si, South Korea), Sungho Suh (Suwon-si, South Korea) and Minsun Keel (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are an image sensor package with improved reliability and a method of fabricating the same. The image sensor package includes: a package substrate; an image sensor chip provided on the package substrate, and including a pixel area and a peripheral area surrounding the pixel area; a dam in the peripheral area, the dam h...