ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,848, issued on Jan. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Kyungdon Mun (Suwon-si, South Korea), Juhyeon Kim (Suwon-si, South Korea), Sangcheon Park (Suwon-si, South Korea) and Taeyoung Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip including a first semiconductor substrate having a first active surface and a first inactive surface opposite to each other, a plurality of through electrodes penetrating the first semiconductor substrate, and a rear cover layer covering the first inactive surfa...