US Patent Issued to SAMSUNG ELECTRONICS on Jan. 27 for "Electronic device including shielding member including structure for reducing deformation" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,412, issued on Jan. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Electronic device including shielding member including structure for reducing deformation" was invented by Jeongseok Lee (Suwon-si, South Korea), Hyein Park (Suwon-si, South Korea) and Jaedeok Lim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device according to an embodiment includes a printed circuit board including a ground pad, an optical sensor disposed on the printed circuit board, and a shielding member covering the optical sensor. The shielding member includes a first adhesive layer attached on the optical sens...